KITAKAMI, Japan-Tuesday 24 July 2018 [ AETOS Wire ]
(BUSINESS WIRE)-- Toshiba Memory Corporation, the world leader in memory solutions, today held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in
Toshiba Memory continues to advance technologies in flash memory. The company is now leading the way forward with advances in its BiCS FLASH™, its proprietary 3D flash memory.
Demand for 3D flash memory is increasing significantly on fast growing demand for enterprise servers, datacenters and smartphones. Toshiba memory expects continued strong growth in the mid and long term. The new facility will make a major contribution to business competitiveness in corporation with Yokkaichi operations.
The new facility will not only be the largest Toshiba Memory fab, but it will be the most advanced as well. It will be constructed with a seismic isolation structure that allows it to absorb earthquake tremors, and it will reduce environmental loads by deployment of the latest energy-saving manufacturing facilities. It will also introduce an advanced production system that uses artificial intelligence (AI) to boost productivity. Decisions on the new fab’s equipment investment, production capacity and production plan will reflect market trends.
Toshiba Memory expects to continue its joint venture investments in the new facility based on ongoing discussions with Western Digital Corporation.
Going forward, Toshiba Memory will continue to actively cultivate initiatives aimed at strengthening competitiveness, including timely capital investments and R&D in line with market trends. The company will also contribute to the development of the regional economy of Iwate prefecture, Japan.
About Toshiba Memory Corporation
Toshiba Memory Corporation, a world leader in memory solutions, is dedicated to the development, production and sales of flash memory and SSDs. In April 2017, Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Toshiba Memory pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high density applications including advanced smartphones, PCs, SSDs, automotive and data centers. For more information on Toshiba Memory, please visit https://business.toshiba-memory.com/en-apac/top.html
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Contacts
Toshiba Memory Corporation
Kota Yamaji, +81-3-3457-3473
Business Planning Division
semicon-NR-mailbox@ml.toshiba.co.jp
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